The inaugural IEEE sponsored workshop on Fiber-Optics, Optoelectronics, Photonics Assembly, Packaging and Manufacturing was held Sept. 15-17, 1999 in scenic Vail, Colorado. The workshop was organized jointly by CPMT and the LEOS to provide an open forum information exchange environment that complements current ongoing committee activities germane to optoelectronics packaging and manufacturing (namely ECTC and the LEOS Annual Meeting). Both NIST and NSF provided grant support for this first time event.
The workshop attracted 170 attendees from around the globe, including participation from Australia, Europe, Far-East, Middle East, and North America. The workshop covered topics ranging from Package Design, Package Components, High Speed Packaging, Array Packaging, Alignment Techniques/Tools, Bonding and Sealing, Hermetic and Non-Hermetic Packaging, and WDM Component Assembly and Packaging.
10 invited speakers and approximately 15 contributed presentations were given throughout the three day event. Session panelists added insight to the workshop topics during lively question and answer discussions following the various presentations. Due to heightened interest developed during the daily sessions, a special evening session was added to enable all presentations to be heard and discussed. And during off-hours, a special case study problem challenged workshop attendees to design the OPTO VEHICLE of the future. Many innovative designs were presented during the workshops Case Study judging segment.
Badri Gomatam, Vitesse Semiconductor, Advances in High Volume Optoelectronic Component Manufacturing
Chip Mueller, W.L. Gore, VCSEL Technology - Enabling Parallel Optics Solutions
Fumihiro Ashiya, NTT, Multi-fiber Optical Connector Interface and Alignment Technologies for PLCs and Optical Transceiver Modules Gilbert Lecarpentier, Karl Suss, Alignment and Bonding Solutions for Optical Packaging
David Ramsey, Lucent Technologies, Hermetic Packaging Overview
John Osenbach, Lucent Technologies, Non-Hermetic Optoelectronic Packaging: Opportunities and Constraints
Michael Chow, Lucent Technologies, Packaging Platform for Isolated Analog and Digital Laser Modules
Jean-Noel Dody, EGIDE, Standardization in Material and Design Shape on Ceramic 14 pin Butterfly Packages"
Robert McLeod, E-TEK Dynamics, WDM Component Packaging Design Methodology
David Wardle, JDS Uniphase, Manufacturing Issues for Component WDMs
|From Left to Right: Michael Lebby, Mario Dagenais, Werner Hunziker, Mino Dautartas, Dariusz Sieniawski, Mark Beranek, Robert Payer.||John Rowlette and Werner Hunziker running special evening
session on alignment techniques/tools.
|Toshiaki Satake and Masataka Itoh at evening reception.|
Al Benzoni, Ortel; Michael Meis, 3M; James Guenter, Honeywell; Randall Heyler, Newport; Mark Beranek, Boeing; Bob Comizzoli, Lucent Technologies; Hongtao Han, Digital Optics; Mark Voitek, Kyocera; Joe Ford, Lucent Technologies; Dariusz Sieniawski, Nortel.
As the fiber-optics industry moves into the next millenium and market demand for optoelectronic components continues to soar, the issues of manufacturing and testing automation, packaging standardization, higher speed packaging, higher density packaging, and packaging integration are becoming more significant. The workshop setting provided optoelectronics packaging engineers, package suppliers, and manufacturing equipment suppliers ample opportunity to discuss many of the key issues in a relaxed, open forum environment. Energetic workshop participation throughout the 3 days produced especially thought provoking and educational discussions. All forces are pointing to another successful workshop in 2000! The next workshop is currently planned for Oct. 3-6, 2000 at The Coeur dAlene Resort () in Coeur dAlene, Idaho. Information updates will soon be available on the CPMT (www.cpmt.org) and LEOS (www.ieee.org/society/leos) websites, or by calling Samantha Padilla, 732-562-3894 or Elsie Cabrera, 732-562-3897 at IEEE LEOS.
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